DI-1100-i3

From: $1,215.00

  • Onboard Intel ® 8th Gen. Core™ U i3 Processor (TDP 15W)
  • 1x 2.5″ front-accessible SATA HDD bay for quick access and 1x mSATA socket
  • 2x full-size Mini PCIe sockets for module expansion
  • 2x front-accessible SIM card slots for signal redundancy
  • Optional CMI modules (2x 10 GbE LAN, M12 A-coded, or M12 X-coded)
  • Optional CFM modules (power ignition sensing, or 4x PoE)
  • Wide operating temperature -40°C to 70°C
  • MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only) certified

Configuration

Not all possible configurations are available below. If you require a configuration that is not available here, please contact us and we will provide a custom quote.

SKU: DI-1100-i3-R10 Category: Tag:

Description

The DI-1100 packs high performance, lots of I/O ports, and expansion flexibility in a compact form factor. The DI-1100 is powered by an 8th Gen Intel® Core™ U-Series processor (Whiskey Lake) with ultra-low 15W TDP yet delivering uncompromised performance. The DI-1100 shines because it fits multiple I/Os and other expansion options into a very compact chassis, making it the perfect high-performance rugged embedded computer for space-constrained environments. The DI-1100 is ideal for industrial applications, logistics and warehousing, transportation, security and surveillance, IoT deployments, and other applications.

The DI-1100 is powered by four cores and eight threads, delivering extraordinary performance and responsiveness to complete computationally intensive tasks more quickly. The processing architecture fulfills the need for increased graphics and computation performance while providing the headroom to consolidate data and applications for IoT deployment. Topped off with a 15W CPU, it’s ideal for mobile machinery reducing the time between recharges for maximum efficiency.

The DI-1100 has a small form factor, measuring only 203 mm (W) x 142 mm (D) x 66.8 mm (H). This compact size makes the DI-1100 easy to install anywhere you can imagine, especially in today’s space-limited IoT applications, ranging from equipment such as Automated Guided Vehicles (AGVs) and Autonomous Mobile Robots (AMRs) to vehicles and the small cabinets in factories.

The DI-1100’s compact design doesn’t sacrifice I/O and functionality. The DI-1100 includes 2x GbE LAN, 4x USB 3.2, 2x USB 2.0, and 2x RS232/422/485 to connect high-speed and legacy devices. The DI-1100 also supports 2x full-size Mini PCIe sockets for wireless connectivity as well as 2x SIM card slots for cellular network redundancy to ensure uninterrupted data transmission. In addition, it offers an external fan for additional cooling when using high-watt peripherals like cameras thru PoE.

The DI-1100 provides modular expansion through Combined Multiple I/O (CMI) and Control Function Module (CFM) and can be configured for further I/O and function customization. This flexibility allows integrators to quickly configure the system and rapidly deploy to the market. The CMI modules include extra LAN, 10GbLAN, M12 connections (A- and X-coded), and various I/O interfaces, while CFM provides power ignition sensing or PoE functionality.

Multiple mounting methods are ready for use in various industrial environments, including wall, side, DIN-rail, and VESA mountings. These mounting options help integrators quickly and easily mount the DI-1100 anywhere, whether on the field side, cabinets, or inside of other equipment.

The DI-1100 is engineered with a robust design to withstand extreme environments. It features a wide operating temperature range of -40 to 70°C, wide-range voltage input of 9 to 48 VDC, over-voltage protection, over-current protection, and ESD protection. The DI-1100 passed the tests to ensure compliance with MIL-STD-810G, E-mark, and EN50155 (EN 50121-3-2 only).

Additional information

CPU

Intel® Core™ i3-8145UE Dual Core

BIOS

AMI 64Mbit SPI

Memory Technology

DDR4 SO-DIMM Socket / 2400MHz ( Un-buffered and non-ECC)

Max. Capacity

32 GB

Socket

1x 260-Pin SO-DIMM

Integrated Graphics

Integrated Intel® UHD Graphics 620

Triple Display Supported

Yes

Audio Codec

Realtek® ALC888, High Definition Audio

LAN

2x GbE LAN, RJ45

USB

2x 10Gbps USB 3.2 Gen2, 2x 480Mbps USB 2.0, Type A, 2x 5Gbps USB 3.2 Gen1, Type A, Type A

COM

2x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9

Line-out

1

Mic-in

1

ATX Power On/Off Button

1

AT/ATX Mode Switch

1

Clear CMOS Switch

1

Remote Power On/Off Connector

1

SSD/HDD

1x 2.5” Front Accessible SATA HDD/SSD Bay ( SATA3.0 )

mSATA

1 (SATA 2.0, Shared by Mini-PCIe Socket)

Mini-PCIe Socket

2 (Full-size)

SIM Socket

2

Control Function Module (CFM) Interface

1

Combined Multiple I/O (CMI) Interface

2

Watchdog Timer

Software Programmable Supports 256 Levels System Reset

Supports Instant Reboot Technology

0.2 sec

Power Type

AT / ATX

Power Supply Voltage

9~48VDC

Power Connector

1x 3-pin Terminal Block

Dimension (WxDxH)

203 x 142 x 66.8 mm

Weight

1.74kg

Construction

Extruded Aluminum with Heavy Duty Metal

Mounting

Wall / VESA (Optional DIN-Rail/Side Mounting)

Unibody Chassis

Yes

Fanless Design

Yes

Jumper-less Design

Yes

Cable-less Design

Yes

Reverse Power Input Protection

Yes

Over Voltage Protection

Protection Range: 51~58V, Protection Type: shut down operating voltage, re-power on at the preset level to recover

Over Current Protection

15A

Surge Protection

2 kV

Windows

Windows® 10

Linux

Supports by project

Operating Temperature

-40°C to 70°C
With extended temperature peripherals, Ambient with air flow
According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14

Storage Temperature

-40°C to 85°C

Relative Humidity

95%RH @ 70°C (non-Condensing)

Shock

MIL-STD-810G

Vibration

MIL-STD-810G

MTBF

513,628 Hours

EMC

CE, E-mark, FCC, ICES-003 Class A, UKCA

Safety

IEC/EN 62368-1

DI-1100 Series Datasheet

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